3g
Infineon Introduces World's Smallest 3G Solutions for Cost Efficient HSDPA to High-end HSUPA Phones
Submitted by Ionela on Mon, 06/02/2008 - 08:44.
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Infineon Technologies announced the availability of its new generation 3G platform family. This new platform family addresses all major 3G market segments and includes a high performance HSPA modem solution, a feature phone solution enriched with high multimedia capabilities and a cost-efficient 3G solution. |
NXP and T3G Deliver Breakthrough TD-SCDMA Solution to Chinese Market
Submitted by Ionela on Wed, 05/28/2008 - 07:26.
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Building on their leadership in TD-SCDMA, NXP Semiconductors and T3G Technologies today announced that the next-generation 3G cellular system solution T3G7208 is now commercially available to the Chinese market. The Nexperia cellular system solution T3G7208 a complete solution for multimode TD-SCDMA / EDGE mobile phones today powers the popular Samsung SGH-L288 handset. Special edition T3G7208 TD-SCDMA phones with added push-to-talk functionality have also been provided by Samsung to the Beijing Olympic Games Organizing Committee. |
TI introduces high-performance 16-bit, 800 MSPS dual-channel digital-to-analog converter for 3G and 4G communications
Submitted by Ionela on Wed, 04/23/2008 - 07:15.
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DALLAS (April 22, 2008) - Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced a 16-bit, dual channel, 800 MSPS digital-to-analog converter (DAC). The new device builds on the field-proven design of the DAC5687 and continues to push the space and performance boundaries in transmit DAC solutions for wireless base stations, software-defined radio applications and multi-frequency test equipment. |
STMicroelectronics and NXP Merge Wireless Businesses to Expand Product Breadth and Boost Innovation
Submitted by Ionela on Fri, 04/11/2008 - 07:39.
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Combining complementary organizations and portfolios will improve competitiveness, speed product development and strengthen R&D scale CEOs to host 6:30pm CET Conference Call to Discuss Transaction Geneva, Switzerland, and Eindhoven, The Netherlands - April 10, 2008 - NXP--the independent semiconductor company founded by Philips--and STMicroelectronics (NYSE:STM), a leader in delivering advanced solutions for mobile products, today announced their agreement to combine key wireless operations to form a joint-venture company with strong relationships with all major handset manufacturers. The new company will have the scale to better meet customer needs in 2G, 2.5G, 3G, multimedia, connectivity and all future wireless technologies. |
