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leadless mosfet

Leadless MOSFET reduces footprint by 50%

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Zetex Semiconductors has announced its first MOSFET to be packaged in the leadless 2mm x 2mm DFN package. With a PCB footprint 50% smaller than industry standard SOT23 packaged devices and an off-board height of just 0.85mm, the ZXMN2F34MA will benefit a range of space-starved switching and power management applications, such as external switches in buck/boost PoL converters, where PCB footprint, thermal performance and low threshold voltage are of prime importance.

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