mou
Fujitsu Global Mobile Platform Inc. Commences Operations
Submitted by Ionela on Wed, 08/06/2008 - 09:16.
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Fujitsu Global Mobile Platform Inc. ("FMPI"), a joint venture established based on a memorandum of understanding (MOU) tied between Fujitsu Limited's former LSI business divisions (currently a separate entity, Fujitsu Microelectronics Limited, "FML") and the Institute for Information Industry ("III") of Taiwan, announced its commencement of operations from today. FMPI will develop reference designs - designs which improve design efficiencies - for WiMAX-related products for Taiwan-based ODM vendors, in addition to providing technical support. |
Infineon is the first semiconductor maker to sign an MoU with the European Commission to advance the development of intelligent
Submitted by Ionela on Thu, 04/10/2008 - 07:07.
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Neubiberg, Germany April 9, 2008 With the signing of a memorandum of understanding (MoU), Infineon Technologies has become the first semiconductor maker to pledge its full support for a European Commission automotive safety initiative. The move adds momentum to eCall, a pan-European proposal launched by the Commission with the goal of encouraging EU member states as well as automakers, mobile operators, service businesses and automotive supply businesses to collaborate on the development of an integrated, automatic accident alert system for automobiles. |
