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semiconductor

IBM and NEC Electronics Sign Agreement for Joint Development of Next-Generation Semiconductor Process Technology

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IBM Corporation and NEC Electronics Corporation announced they have entered into a multi-year joint development agreement under which they will develop next-generation semiconductor process technology. Under the agreement, NEC Electronics will participate in a joint development project for the next-generation core CMOS process, at the 32-nm node, and in advanced fundamental research for leading-edge semiconductor technologies of the future.

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