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STMicroelectronics, STATS ChipPAC and Infineon to Set New Milestone in Establishing Wafer-Level-Packaging Industry Standard - In
Submitted by Ionela on Fri, 08/08/2008 - 08:15.
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STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon's first-generation technology, for use in manufacturing future-generation semiconductor packages. |
STMicroelectronics and NXP Complete Deal to Create New Wireless Semiconductor Company
Submitted by Ionela on Wed, 07/30/2008 - 12:53.
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NXP-the independent semiconductor company founded by Philips and STMicroelectronics, a leader in delivering advanced silicon solutions for mobile products, announced the closing of the deal bringing together key wireless operations of both companies into ST-NXP Wireless, a deal they announced on April 10th, 2008. The joint venture, which will start operations on August 2nd, launches as a solid top-three industry player with a complete wireless product and technology portfolio and as a leading supplier to major handset manufacturers who together ship more than 80% of all handsets. ST-NXP Wireless will be among the few companies with the R&D scale and expertise to meet customer needs in 2G, 2.5G, 3G, multimedia, connectivity and all future wireless technologies. |
