wlan
World’s smallest front-end module for WLAN and Bluetooth
Submitted by Ionela on Tue, 03/25/2008 - 08:46.
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EPCOS has developed the most compact all-in-one front-end module worldwide for Bluetooth and WLAN applications to the 802.11 b/g/n standard. With an insertion height of 1.4 mm, it has a footprint of only 4.5 x 3.2 mm² on the circuit board. The module integrates a WLAN power amplifier, a WLAN-Bluetooth switch, a receive balun, and a bias circuit with ESD protection. In addition, the coexistence filter allows simultaneous operation of WLAN and Bluetooth applications with all mobile phone standards. |
Infineon First to Bring Voice-over-WLAN to Low-Cost Mobile Handsets
Submitted by Ionela on Tue, 03/18/2008 - 08:21.
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Neubiberg, Germany, San Jose, USA, March 17, 2008 Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, is the first semiconductor supplier to offer Voice-over-IP functionality for low-cost mobile phones, and enabling operators to offer fixed-mobile convergence by integrating Wi-Fi on its mobile phone platform. The solution helps to significantly reduce the bill-of-materials (BOM) cost for Wi-Fi enabled cell phones by up to 50 percent compared to existing solutions. |
