Infineon Announces Industry%u2019s First High-Performance LDMOS RF Power Transistors in Copper-Based Open-Cavity Plastic Package
Submitted by Ionela on Wed, 06/18/2008 - 07:19.
 |
Infineon Technologies announced a new family of RF power transistors in an innovative open-cavity plastic package with a copper base. The new EPOC (Enhanced Plastic Open-Cavity) pack-age offers a 12 percent improvement in thermal resistance – compared to existing solutions – due to the better thermal conductivity of copper, allowing superior thermal and RF performance that are similar to traditional ceramic packages, but at a lower total cost and with improved reliability. With its EPOC package, thin-die and proprietary die-attach technologies, Infineon achieves the best thermal performance with high reliability and consistency for a high-volume cellular infrastructure market. |
